AI & Data Center
Boards That Feed the Compute Era
AI accelerators, switch fabrics and server backplanes with 112G SerDes, ultra-low-loss laminates and 24+ layers. Signal integrity engineered from stackup to via.
What We Build
Where every picosecond and every dB counts.
AI Accelerator Boards
High-layer HDI substrates for GPUs and ASICs with dense BGA fan-out and via-in-pad.
Switch & Router Fabric
112G/224G-class routing on ultra-low-loss laminates with back-drilled stubs.
Backplanes & Midplanes
Thick, high-layer-count boards with controlled impedance across long channels.
Power Delivery / PDN
Low-inductance power planes and heavy copper for multi-hundred-amp core rails.
Why AtlasPCB for Compute
Signal integrity you can measure.
Low-Loss Materials
Megtron, Tachyon and Rogers-class laminates qualified for 112G SerDes and beyond.
High-Layer HDI
24–32+ layers with stacked microvias, back-drilling and via-in-pad for dense BGAs.
Impedance & TDR
±8% impedance control with TDR reports and pre-production Si simulation.
Engineering Review
Stackup, via and loss budget verified by an engineer before your board is fabricated.
Key PCB Requirements
- Ultra-low-loss laminates (low Dk/Df)
- Back-drilling for stub removal on high-speed nets
- 24–32+ layers with stacked/staggered microvias
- Tight impedance control (±8%) with TDR verification
Recommended PCB Types
FAQ
AI & Data Center FAQ
We qualify ultra-low-loss systems such as Panasonic Megtron 7/8, ISOLA Tachyon and Rogers hybrids, matched to your channel loss budget and confirmed before build.
Yes — controlled-depth back-drilling to remove via stubs is standard for our high-speed and backplane work, with target stub lengths verified in CAM.
We routinely build 24–32+ layer boards and can advise on stackup, aspect ratio and lamination cycles for very high layer counts.
Building the next AI board?
Send your stackup and channel requirements for a free SI review.